<?xml version="1.0" encoding="UTF-8"?>
<rdf:RDF xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns="http://purl.org/rss/1.0/" xmlns:rdf="http://www.w3.org/1999/02/22-rdf-syntax-ns#">
<channel rdf:about="http://hdl.handle.net/123456789/2747">
<title>ELECTRONICS PACKAGING</title>
<link>http://hdl.handle.net/123456789/2747</link>
<description/>
<items>
<rdf:Seq>
<rdf:li rdf:resource="http://hdl.handle.net/123456789/2763"/>
</rdf:Seq>
</items>
<dc:date>2026-04-05T17:07:10Z</dc:date>
</channel>
<item rdf:about="http://hdl.handle.net/123456789/2763">
<title>FUNDAMENTALS OF MICROSYSTEMS PACKAGING</title>
<link>http://hdl.handle.net/123456789/2763</link>
<description>FUNDAMENTALS OF MICROSYSTEMS PACKAGING
RAO R TUMMALA
</description>
<dc:date>2004-01-01T00:00:00Z</dc:date>
</item>
</rdf:RDF>
